The Chinese University of Hong Kong (CUHK) signed a Letter of Intent on Strategic Collaboration with TCL Corporate Research (Hong Kong) on August 2, 2017, expanding new spectrum of research collaboration. Prof. Benjamin Wah, Acting Vice-Chancellor of CUHK; and Prof. Wong Ching-ping, Faculty Dean of Engineering, attended the signing ceremony on behalf of the University.
Prof. Wah said at the ceremony remarks that CUHK is motivated to launch collaboration plans with TCL, a leader in the industries of global smart product manufacturing and Internet services. "Information and Automation Technology is one of the four major research areas in the University's Strategic Plan 2016-20. We would take this opportunity to launch research collaboration projects with TCL on big data and artificial intelligence (AI) to further build up the momentum in relevant fields of research and the partnership deveopments among academia and knowledge transfer as well as the industry, so as to develop technologies beneficial to humans."
CUHK is committed to striving for its research excellence, while placing great emphasis on the development of both innovation and entrepreneurship. The University was ranked the top among local institutions in the Asia Pacific's Most Innovative Universities released by Reuters in 2016. At present, CUHK has over 600 authorized patents around the world, most of which have been developed into products well received by the market. The collaboration established with TCL will help actualize the win-win scenario of technological innovation with business and industrial application, including transfer of technological achievements, establishment of joint laboratories, nurture of talents and internship training.